发明名称 |
Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers |
摘要 |
A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.
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申请公布号 |
US6645046(B1) |
申请公布日期 |
2003.11.11 |
申请号 |
US20000607743 |
申请日期 |
2000.06.30 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
VOGTMANN MICHAEL;FREDERICKSON CHRIS;GASPARITSCH JEFF;HEMPEL GENE;ENGDAHL ERIK |
分类号 |
B24B21/04;B24B37/04;B24B49/16;B24B53/12;(IPC1-7):B24B49/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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