Electrical device having metal pad bonded with metal wiring and manufacturing method thereof

摘要

A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 mum. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 mum or more.