发明名称 METHOD AND DEVICE FOR CUTTING GLASS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and a device for cutting glass capable of cutting the glass at a high speed and with high accuracy. <P>SOLUTION: A laser beam having a front end with a low energy density and a rear end with a high energy density is irradiated to the glass to be processed. When such laser beam is irradiated to the glass, the glass is heated after being preheated and the thermal shock is maximized. In addition, the glass is divided into several zones, and the moving speed and the energy of the laser beam are controlled according to the thermal stress distributions of the each zone. With such a structure, the quality of the cutting surface of the glass is improved and cuttings of the glass can be performed at a high speed. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003321234(A) 申请公布日期 2003.11.11
申请号 JP20020129015 申请日期 2002.04.30
申请人 LG ELECTRONICS INC 发明人 KANG HYOUNG SHIK;HONG SOON KUG;OH SEOK CHANG;SONG MIN GYU;BAEK KWAN YEOL
分类号 B26F3/00;B23K26/00;B23K26/073;B23K26/08;B23K26/14;B23K26/18;B23K26/40;C03B33/09;(IPC1-7):C03B33/09 主分类号 B26F3/00
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