| 摘要 |
A multilayer circuit board comprising at least one substantially void free encapsulated heavy copper core and methods for producing such a board. Such a board may be formed by providing a first core that includes a substrate and heavy copper circuit traces, filling the spaces between circuit traces with a resin, and at least partially curing the resin so as to form two exposed and substantially planar surfaces on opposite sides of the core. The filled and planarized core is then laminated with additional dielectric layers to form a fully cured, void free multilayer printed circuit board. |
