| 摘要 |
A substrate 6 a having terminals 9 thereon is bonded to a wiring board 11 having output terminals 11 c thereon through an ACF 20 . The pitch P 2 of the output terminals 11 c is different from the pitch P 1 of the terminals 9 taking into account deformation of the substrate 6 a or the wiring board 11 during bonding. When the substrate 6 a or the wiring board 11 deforms during the bonding, the both terminals are connected with the pitch P 1 ' of the terminals 9 and the pitch P 2 ' of the output terminals 11 c becoming approximately equal to each other. |
