HEAT SINK DEVICE

摘要

PURPOSE: A heat sink device is provided to discharge air smoothly by adjusting a discharge direction even if a position of a discharge hole of a main body case is changed to the heat sink device. CONSTITUTION: A heat sink assembly(10) absorbs the heat generated from a heat emitting part such as a CPU and discharges the heat to out side by contacting to an upper face of the CPU. A cooling fan assembly(22) circulates the air to an upper part by installing to the upper part of the heat sink assembly(10). A duct supporting panel(28) offers a flat supporting surface(62) and has an air path(46) passing the air from the cooling fan assembly(22) by fixing to the upper part of the cooling fan assembly(22). A discharge duct(36) guides the air flow from the upper part to a discharge fan by installing on the duct supporting panel(28).