发明名称 ELECTRODE SUBSTRATE AND ELECTRODE
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive electrode substrate causing no buckling and no fracture in the boundary area of a collecting part having no hole and a perforated part, possible to be further miniaturized and lightened, and possible to have a high performance, and an electrode using this substrate. SOLUTION: In this electrode substrate, the collecting part 2 having no hole, the perforated part 4, and an intermediate part 3 between both parts where a perforation rate is gradually reduced from the perforation rate of the perforated part toward the zero perforation rate of the collecting part are formed on nickel foil of thicknesses of 8-30μm, which is manufactured by an electrolytic deposition method. This electrode is formed by having a desired active material carried on the surface of the substrate. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003317723(A) 申请公布日期 2003.11.07
申请号 JP20020119359 申请日期 2002.04.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUNEMATSU SHOICHI;NOMI RYOICHI;SETO HIROHISA;SUENAGA SATORU
分类号 H01M4/66;H01M4/70;H01M4/80;(IPC1-7):H01M4/66 主分类号 H01M4/66
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