| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with electronic component mounted thereon that can prevent solder from being left in the non-soldered portion of a conductor pattern at the time of mounting an electronic component on an insulating substrate. SOLUTION: This substrate with electronic component mounted thereon is provided with the insulating substrate 42 having the conductor pattern 44 formed on at least its one surface, and a through hole 50 formed through the substrate 42 from the conductor pattern 44 to the other surface and the electronic component having a lead 46. The lead 46 is inserted into the through hole 50 from the other surface side of the substrate 42 so that the lead 46 may be protruded from the conductor pattern 44 side surface of the substrate 42, and the protruded section of the lead 46 is joined to the conductor pattern 44 in a land region 62 around the through hole 50 with solder 64. A heat insulating layer 60 is formed on the pattern 44 except the land region 62 by using ink used at the time of printing visual symbols, such as characters, marks, etc., on the insulating substrate 42. COPYRIGHT: (C)2004,JPO
|
