| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a wide working space is required and, at the same time, the capital investment becomes higher for performing a solder resist forming process. SOLUTION: At the time of forming a solder resist on the surface of a printed wiring board 30, a semi-curing furnace 4 to which the transporting speed of the board 30 and the temperature in the furnace 4 can be set is used as a facility of defoaming a solvent after resist ink 40 is applied to the board 30 to a fixed film thickness. In the furnace 4, the solvent is defoamed and the printed wiring board 30 is predried by leaving the board 30 as it is for a prescribed period of time (1.5-2.5 minutes) until the temperature in the furnace 4 reaches 40°C at which the ink 40 starts to be cured from room temperature, and maintaining the board 30 for 15-20 minutes until the temperature in the furnace 4 reaches 80-97°C at which the ink 40 is cured by setting the transporting speed of the board 30 and the temperature in the furnace 4. COPYRIGHT: (C)2004,JPO
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