| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor layer forming method which is capable of forming a fine conductor layer with high accuracy and reducing the equipment cost and the running cost related to the formation of the conductor layer. SOLUTION: Partitions 4 demarcating paste filling regions 5 are provided to an object 3, the paste filling regions 5 are filled with conductive paste 6, then baking heat is applied to the conductive paste 6 filling the paste filling regions 5 to form a conductor layer 7. The partitions 4 are dissipated by the heat to form the conductor layer 7 having a desired pattern or a desired shape corresponding to the paste filling regions 5 in the object 3. COPYRIGHT: (C)2004,JPO
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