| 摘要 |
PROBLEM TO BE SOLVED: To provide a high dielectric constant substrate material without adding a large quantity of high dielectric constant powder for manufacturing the high dielectric constant substrate material used as a printed wiring board or a capacitor material or the like, and to provide the high dielectric constant substrate material superior in a mechanical characteristic by a relatively simple manufacturing method. SOLUTION: In the high dielectric constant substrate material, the high dielectric constant powder is added to a molten polymer, and this polymer composition is subjected to an alignment treatment by an ultrasonic field and is then solidified. COPYRIGHT: (C)2004,JPO
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