| 发明名称 |
METHOD OF MANUFACTURING DISPLAY PANEL |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an arrangement method of a bonding material with which the bonding material can be arrayed evenly in a comparatively simple way so that it scarcely happens that a part is applied and a part is not applied with the bonding material at a narrow area of a tip-top part of a partition wall. SOLUTION: A partition wall 18 of a back face panel PA2 is made in contact with a paste layer 40 of the bonding material with a flattened surface and the bonding material Bd is applied evenly on the tip-top part of the partition wall. COPYRIGHT: (C)2004,JPO
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| 申请公布号 |
JP2003317622(A) |
申请公布日期 |
2003.11.07 |
| 申请号 |
JP20030122368 |
申请日期 |
2003.04.25 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SASAKI YOSHIKI;HIBINO JUNICHI;YAMAMITSU CHOJURO;YONEHARA HIROYUKI;YAMASHITA KATSUYOSHI;KIRIHARA NOBUYUKI;OTANI KAZUO;TAKADA YUSUKE;YASUI HIDEAKI;MURAI RYUICHI;TONO HIDETAKA;NAGAO NOBUAKI;OKAWA MASAFUMI;TANAKA HIROYOSHI |
| 分类号 |
H01J9/26;H01J9/02;H01J11/22;H01J11/34;H01J11/36;H01J11/40;H01J11/48;(IPC1-7):H01J9/26;H01J11/02 |
主分类号 |
H01J9/26 |
| 代理机构 |
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