发明名称 METHOD FOR MANUFACTURING LEAD FRAME AND LEAD FRAME THEREOF
摘要 PURPOSE: A method for manufacturing a lead frame and the lead frame thereof are provided to be capable of removing particles at the lead frame by using supersonic waves. CONSTITUTION: An electro cleaning process is carried out at the surface of a thin plate(20). An electro polishing process is then carried out at the thin plate(40). The particles generated at the thin plate while carrying out the electro polishing process, are removed(50). A cleaning process is carried out at the thin plate by using an acid solution(60). A multi-plating layer is formed at the thin plate(70). At this time, the particles are removed by supplying supersonic waves for 3-7 second in a predetermined solution.
申请公布号 KR20030085878(A) 申请公布日期 2003.11.07
申请号 KR20020024170 申请日期 2002.05.02
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 JUNG, SEUNG HO;KANG, SEONG IL;PARK, SE CHEOL
分类号 H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/495
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