发明名称 |
METHOD FOR MANUFACTURING LEAD FRAME AND LEAD FRAME THEREOF |
摘要 |
PURPOSE: A method for manufacturing a lead frame and the lead frame thereof are provided to be capable of removing particles at the lead frame by using supersonic waves. CONSTITUTION: An electro cleaning process is carried out at the surface of a thin plate(20). An electro polishing process is then carried out at the thin plate(40). The particles generated at the thin plate while carrying out the electro polishing process, are removed(50). A cleaning process is carried out at the thin plate by using an acid solution(60). A multi-plating layer is formed at the thin plate(70). At this time, the particles are removed by supplying supersonic waves for 3-7 second in a predetermined solution. |
申请公布号 |
KR20030085878(A) |
申请公布日期 |
2003.11.07 |
申请号 |
KR20020024170 |
申请日期 |
2002.05.02 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
JUNG, SEUNG HO;KANG, SEONG IL;PARK, SE CHEOL |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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