INTERPOSER SUBSTRATE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having high mounting reliability. SOLUTION: The semiconductor device (100) comprises: two or more wiring substrates (1, 2) having thermal expansion coefficients and areas different from each other and laminated so that the areas are sequentially reduced toward a side near a semiconductor bare chip (5) via a stress relaxing layer (3) disposed between the substrate (1) and the substrate (2) to form a circuit on an interposer substrate (41); one or a plurality of semiconductor bare chips (5) face-down mounted on the substrate (41) to relax a stress concentration at each mounting part when mounted on a mother board. COPYRIGHT: (C)2004,JPO