| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that can be soldered to a circuit board with a fixed amount of solder without giving any thermal stress to the circuit board, and to provide a method of soldering the electronic component and electronic equipment using the component. SOLUTION: The electronic component 1 has leads 2 wound with solder wire 6. Since the solder 6 can be presupplied into through holes 5 by using the electronic component 1, soldering can be performed by only heating the leads 2. Consequently, thermal stresses are hardly applied to the circuit board 3, and the occurrence of such defective soldering that is caused by the thermal expansion or thermal shrinkage of the circuit board 3 and causes the peeling of lands 4 or the contents of the through holes 5 can be prevented, because the direct heating of the circuit board 3 is not required. Therefore, highly reliable electronic equipment can be provided by using the electronic component 1. COPYRIGHT: (C)2004,JPO |
