| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small-size semiconductor package having a smooth circuit pattern formed on the surface of insulation resin in order to solve the problem that external connection terminals of the semiconductor package are not completely uniformed in heights and there are slight variations in the heights. <P>SOLUTION: The semiconductor package has such a structure that a semiconductor element is sealed in the insulation resin and the smooth circuit pattern formed of metal foil is formed on the surface of the insulation resin. A method of manufacturing the semiconductor package comprises steps of: forming a prescribed circuit pattern on the metal foil formed face of an adhesive tape which is attached with the metal foil on the surface; disposing an electronic component including the semiconductor element on the metal foil and, connecting the electronic component to the metal foil formed face via a conductor or connecting it to the metal foil formed face; thereafter, sealing the electronic component connected to the metal foil formed face together with the metal foil formed into the circuit pattern by the insulation resin; and releasing the metal foil and the adhesive tape. <P>COPYRIGHT: (C)2004,JPO</p> |
