| 摘要 |
<P>PROBLEM TO BE SOLVED: To alleviate a deflection of an interlayer insulating film caused by an external force (load or the like) when a semiconductor integrated circuit device is mounted (at bonding) so as to protect a protective film against fissures caused by the deflection of the insulating film. <P>SOLUTION: The inter-wiring space P1 of a first wiring layer 1 in the interlayer insulating film 2 is narrowed, so that the first wiring layer 1 in the interlayer insulating film 2 is increased in total amount, and the interlayer insulating film 2 which is low in hardness to cause deflection is reduced in total amount. As the result, and stress caused by the deflection of the interlayer insulating film 2 is hardly imposed on the protective film 4 formed on the interlayer insulating film 2, so that fissures hardly occur in the protective film 4. Therefore, troubles such as the disconnection of a second wiring layer 3 caused by the fissures occurring in the protective film 4 can be prevented, and the semiconductor integrated circuit device of high reliability can be obtained. <P>COPYRIGHT: (C)2004,JPO |
