| 摘要 |
PROBLEM TO BE SOLVED: To resolve the problem of a conventional surface-mounted piezoelectric oscillator which requires restarting of designing quartz oscillators to be mounted for making it thinner, and when adhesion materials such as an electrically conductive adhesives is applied on top surface of the quartz oscillator lid to mount an oscillator cover, an additional manufacturing process of heat setting process is required. SOLUTION: In a surface-mounted piezoelectric oscillator, which consists of a tabular insulated-substrate having a circuit pattern on one side and external connection pads to the other substrates and grounding electrodes on the other side with multiple electronic circuitry elements and a piezoelectric oscillator, whose inside-of-container is hermetically sealed using an insulated container and a lid mounted on the circuit pattern, the lid of the piezoelectric oscillator is designed to be larger than the circumference size of the upper section of the insulated container consisting the piezoelectric oscillator, as well as large enough, to cover at least one top surface of other electronic circuitry elements on the tabular insulated-substrate. COPYRIGHT: (C)2004,JPO
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