| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a light emitting device that can suppress bimetal effects and has a high heat dissipating property. <P>SOLUTION: This light emitting device is provided with a metallic plate 11 containing a plate-shaped first portion 11a and a second portion 11b thicker than the portion 11a, a semiconductor substrate 12 disposed on the plate 11, a semiconductor laser element 13, a wavelength conversion element (optical element) 14 which receives the laser beam emitted from the laser element 13. The laser element 13 is disposed on the semiconductor substrate 12 above the second portion 11b and the wavelength conversion element 14 is disposed on the substrate 12 above the first portion 11a. The thickness of the first portion 11a is set to suppress bimetal effects occurred among the first portion 11a, semiconductor substrate 12, and wavelength conversion element 14. <P>COPYRIGHT: (C)2004,JPO</p> |
