| 摘要 |
PROBLEM TO BE SOLVED: To make the thickness of a board uniform and improve the reliability of interlayer connection in a method for manufacturing a circuit board to be used for a compact electronic device or the like. SOLUTION: The method for manufacturing a circuit board wherein a board material 1 made of single or plural materials is used includes a pressing step for pressing the board material in the direction of thickness, a hole formation step for forming a penetrating hole or a non-penetrating hole in the board material and filling the penetrating hole or non-penetrating hole with a conductive paste in prior to the pressing step, and a void formation step for making a hole at one or plural places in a part of the board material. COPYRIGHT: (C)2004,JPO |
