发明名称 DIELECTRICS AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a dielectrics changes electrical capacitance less at a high temperature, and a printed wiring board using the same. SOLUTION: A dielectrics 1 comprises an inorganic filler 2 whose dielectric constant is 100-1,000 and a resin material 3. The inorganic filler 2 is a fibrous material and covered with a conductive film. The printed wiring board comprises a conductor layer on an insulating board, and a capacitor 8 connected to the conductor layer. In the capacitor 8, the dielectrics 1 is interposed between a positive electrode plate 81 and a negative electrode plate 82. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003318063(A) 申请公布日期 2003.11.07
申请号 JP20020124803 申请日期 2002.04.25
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA
分类号 H05K1/16;H01G4/18;H01L23/12;H01L23/14;H05K1/03;H05K1/18;(IPC1-7):H01G4/18 主分类号 H05K1/16
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