| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer vessel which has superior portability and a size in which a plurality of vessels can be carried at a time, and by which a wafer is easily displaced between itself and a normally used transportation case, without requiring a large storage space. SOLUTION: A plurality of semiconductor wafers 12 that are housed in the transportation case by arraying so that principal surfaces face to each other with housing pitches of 1/4 inches (6.35 mm) are displaced and housed in a vessel main body 13 to store. A housing pitch in a direction in which the principal surfaces face to each other at displacing is made 1/8 inches (3.175 mm) that is a half of the housing pitch of the transportation case. COPYRIGHT: (C)2004,JPO |
