| 摘要 |
PROBLEM TO BE SOLVED: To assure reduction in the size and thickness of a case container in which the lead material of a metal lead is passed and disposed and high sealability for isolating a circuit element housed in a case from an external environment in a hollow package. SOLUTION: In the glass package 1 for the electronic component, a glass container 20 in which a pair of lead members 11, 12 are passed and disposed is adhesion-molded by insersion molding for injecting the glass material of a molten state. The members 11, 12 passing through opposed sidewalls of the glass container 22 have a circuit element 15 assembled between its distal end electrodes 13 and 14, and the opening of the container 22 is hermetically sealed by an insulating cap member 24. Preferably, sealability between the members 11 and 12 is enhanced by a sealing resin formed by pouring and filling an organic impregnant in the air gap of a boundary between the members 11, 12 and the container 22 to prevent the influence of the element 15 from an external field. The sealing resin 20 is filled by pouring and curing the impregnant of a crosslinking polymerization type containing an acrylic resin as a main component in an unavoidable small gap 20x of the boundary surface for bringing both the container 22 and the members 11, 12 into close contact in a vacuum in a heating impregnating step after the container 22 and the members 11, 12 are brought into close contact and molded. COPYRIGHT: (C)2004,JPO
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