| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component capable of preventing such defects as cracking and delamination after baking even if a ceramics green sheet and an internal electrode pattern are made into a thin layer for many layers. SOLUTION: t<SB>2</SB>/t<SB>1</SB>≥0.3 is established where t<SB>1</SB>is the thickness of a ceramics green sheet 23 which forms an inner-layer laminate 31 and t<SB>2</SB>is the thickness of an internal electrode pattern 27. SHR<SB>2</SB>-SHR<SB>1</SB>≤1% is established where SHR<SB>1</SB>is the firing shrinkage of the inner-layer laminate 31 and SHR<SB>2</SB>is that of an external laminate 33. COPYRIGHT: (C)2004,JPO
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