发明名称 IC CARD AND IC CARD MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve the response speed of an IC card by developing adhesive strength of the IC card from the beginning and to prevent the IC card from curling. <P>SOLUTION: The IC card having an electronic component 5, constituted by uniting an IC chip 5a and an antenna 5b, between a 1st sheet member 1 and a 2nd sheet member 2 across moisture-curing type adhesives 3 and 4 is manufactured by one or more 1st sheet members 1 and 2nd sheet members 2 of 0.005 to 20% in equilibrium moisture content on a 25&deg; and 60% RH condition, the moisture-curing type adhesives 3 and 4, and the electronic component 5. Further, the IC chip is manufactured by using one or more 1st members 1 and 2nd sheet members 2 of 0.005 to 30% in water absorption, the moisture- curing type adhesives 3 and 4, and the electronic component 5. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003317069(A) 申请公布日期 2003.11.07
申请号 JP20020123323 申请日期 2002.04.25
申请人 KONICA MINOLTA HOLDINGS INC 发明人 HATTORI RYOJI;TAKAHASHI HIDEKI;UCHIHIRO SHINJI
分类号 B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/10
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