| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonding method realizing a bonding with good thermal conduction efficiency and a bonding under a relatively low temperature environment. <P>SOLUTION: In die bonding in which a chip 1 is fixed to a substrate made of a metal plate, ceramics or the like, a plurality of projections 22A (25A) comprising a metallic layer are formed on at least one of both bonding faces, and both of the bonding faces are pinched in such a manner that they are pressure-welded. In a die bonding method, ultrasonic oscillations W in a direction parallel to the bonding face are applied to the bonding faces that are pressure- welded under a predetermined pressure F due to the pinching to perform the metallic diffusion bonding of the faces. <P>COPYRIGHT: (C)2004,JPO |
