| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration in electrical characteristics and bonding faults due to variations in housing position, when housing an electronic component element. SOLUTION: A region for engaging with the electronic component element 4 is formed on the internal wall of a concave portion 3 for housing the element 4, and a notch 23 for receiving excess portion of a conductive adhesive 12 is provided on the engaging portion. COPYRIGHT: (C)2004,JPO
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