| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively mount an electronic component such as a bare IC chip on a substrate with high reliability by giving thermal energy and to mount it on the substrate with good working efficiency without a fear of generation of cracks and warp in the substrate. <P>SOLUTION: The device has a carrying-in means 25 of a substrate 2, a preheat means 23 for preliminarily heating the carried-in substrate, a supporting table 21 and a Y-direction table 20 for holding and heating the preliminarily heated substrate 2 and positioning it, a mounting means 17 for mounting a bare IC component 3 and an electronic component 4 in the substrate 2 on the supporting table 21, a post heat means 24 for slowly cooling the substrate 2 whereon the bare IC component 3 and the electronic component 4 are mounted, and a carrying-out means 26 of the substrate 2. A plurality of heating stages 27, 28 and 29, 30 which can control temperature respectively are provided to a pre-heat means 23 and a post heat means 24, and are used alternately. <P>COPYRIGHT: (C)2004,JPO |
