| 摘要 |
PROBLEM TO BE SOLVED: To surely conductively connect a semiconductor chip to rewiring and to batch-process a plurality of semiconductor chips in a semiconductor device having a connecting terminal by a solder ball even if the chip is different from a substrate of the device in size. SOLUTION: A plurality of semiconductor chips 21 are adhered to an adhesion layer 42 on a base plate 41. Insulating films 26, 39, base metal layers 31, 32, rewirings 32, 36, salient poles 33, 37 and the solder ball 38 are formed in batch for a plurality of the chips 21. In this case, the base metal layers 31, 35 are formed by sputtering, and the rewirings 32, 36 are formed by electrolytic plating. After the base plate 41 and the layer 42 are removed, the films 26, 39 are cut between the chips 21. The ball may be formed under the pole 33 formed in a through hole 28 of the film 26. A plurality of the semiconductor devices of the same types or different types may be laminated. COPYRIGHT: (C)2004,JPO |
