发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS FABRICATING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance withstand voltage of the capacitance insulation film of a capacitor constituting the step-up circuit (step-down circuit) of a nonvolatile memory. SOLUTION: Polysilicon films (10b, 20) laid in two layers and constituting the floating gate of a nonvolatile memory also constitute a capacitor electrode CE. The lower layer polysilicon pattern 10b is formed not to touch the boundary of an element forming region and an isolation region 6. Furthermore, a silicon oxide film 19 is formed on the boundary of the element forming region and the isolation region 6. The polysilicon film 20 is formed on the polysilicon pattern 10b and the silicon oxide film 19 to extend over the isolation region 6 and a joint to a first layer interconnect M1, i.e., a plug P1, is formed above the isolation region 6 and the polysilicon film 20. According to the arrangement, the capacitance insulation film 9c can be protected against breakdown due to concentration of field at the end part of the isolation region 6. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003318288(A) 申请公布日期 2003.11.07
申请号 JP20020117518 申请日期 2002.04.19
申请人 HITACHI LTD;HITACHI ULSI SYSTEMS CO LTD 发明人 NISHIMOTO TOSHIAKI;MUKODA HIDEFUMI
分类号 H01L21/8247;H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824;H01L21/823 主分类号 H01L21/8247
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