发明名称 METHOD FOR MANUFACTURING SILICON EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a silicon epitaxial wafer, which further improves the crystalline property of an epitaxial layer. SOLUTION: The silicon epitaxial layer 1 is grown on a silicon monocrystalline substrate W by chemical vapor deposition using a monosilane (SiH<SB>4</SB>) gas as a material at a growth temperature, for instance, of 700°C and in a reduced pressure atmosphere (hydrogen gas atmosphere). Thus formed silicon epitaxial wafer EPW is then subjected to thermal treatment without being taken out from a reactor where chemical vapor deposition has been performed. In this way, polycrystalline silicon 2 which is partially contained in the silicon epitaxial layer 1 is turned to monocrystal. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003318109(A) 申请公布日期 2003.11.07
申请号 JP20020119460 申请日期 2002.04.22
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 HAGIMOTO KAZUNORI;OKA TETSUSHI
分类号 C30B29/06;H01L21/20;H01L21/205;H01L21/336;H01L29/78;(IPC1-7):H01L21/20 主分类号 C30B29/06
代理机构 代理人
主权项
地址