| 摘要 |
PROBLEM TO BE SOLVED: To surely correct a wire bonding position without being affected by change of reflectance of a resin surface, burr of resin or the like regarding a semiconductor device constituted, so that a semiconductor chip and a lead terminal of a resin case are electrically connected by wire bonding. SOLUTION: A recognition mark 22 is parallel to the surface of a bonding pad 11 of a semiconductor chip 1 and is almost as high as it, and is constituted of a mirror surface or a resin surface of almost an mirror surface in a semiconductor chip storing case 2. The circumference of the recognition mark 22 is made a tilting surface 23 which tilts to the resin surface of the recognition mark 22. Alternatively, the circumference of the recognition mark 22 is made a dull surface. COPYRIGHT: (C)2004,JPO
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