发明名称 METHOD FOR FABRICATING MULTI-LAYERED COMPONENT MOUNT DEVICE AND DEVICE FABRICATED THEREBY
摘要 PURPOSE: A method for fabricating a multi-layered component mount device and a device fabricated thereby are provided to mount the second components on an upper surface of the first components by using a support portion without forming a groove on a substrate. CONSTITUTION: A method for fabricating a multi-layered component mount device includes a base preparation process, the first component and a support portion loading process, a molding process, a cutting process, and the second component loading process. The base preparation process is to prepare a base(31). The first component and a support portion loading process is to load the first components(32) and a plurality of support portions(34) on an upper surface of the base(31) in such a manner that at least two more support portions are arranged in the vicinity of the first components. The molding process is to mold the entire surface of the base(31) including the first components(32) and the support portion(34). The cutting process is to cut the molded base(31). The second component loading process is to mount the second components(35) on the upper surface of the cut base(31).
申请公布号 KR20030085868(A) 申请公布日期 2003.11.07
申请号 KR20020024153 申请日期 2002.05.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JONG TAE;YOO, JAE IL
分类号 H01L25/00;H01L21/56;H01L25/10;H03B5/32;H05K1/18;(IPC1-7):H05K1/18 主分类号 H01L25/00
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