| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic circuit substrate in which, when an Al-SiC composite is drawn from an invading mold, the composite is easily drawn from the mold and a heat sink pin is not bent in the substrate in which a heat sink component made of the Al-Sic composite having the ceramic substrate and the heat sink pin is metallic-connected via aluminum. <P>SOLUTION: The ceramic circuit substrate comprises a ceramic substrate metallic-connected to one main surface of the Al-SiC composite via aluminum; and the heat sink pin made of aluminum impregnated into the Al-SiC composite and formed integrally with the other main surface of the Al-SiC composite. In this substrate, the height of the base of the pin to the distal end is four times or less as large as the diameter of the base of the pin. <P>COPYRIGHT: (C)2004,JPO</p> |
