| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered laminated board by which circuit boards can be laminated upon another without causing interlayer positional deviations and, at the same time, is excellent in productivity. SOLUTION: A multilayered laminated board is manufactured by laminating a plurality of circuit boards 1 upon another and uniting the boards 1 in one body through insulating layers 4 formed of prepreg 2, after the circuit boards 1 are laminated upon another through the prepreg 2, and coupling the circuit boards 1 with both sides of the prepreg 2 by partially melt-fixing the resin of the prepreg 2 to the circuit boards 1, by locally heating and pressurizing the circuit boards 1 at temporary fixing sections 3 provided at the end sections of the multilayered laminated board. At this time, circuit boards on which circuits are formed by etching metal foil and left metal foil sections 6 are formed by leaving the metal foil at the positions of the temporary fixing sections 3 separated from the circuits are used as the circuit boards 1. COPYRIGHT: (C)2004,JPO |
