发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring having a surface insulating layer in which a resin is surely photoset as a whole and, in addition, which has a covering property. SOLUTION: This printed wiring board is composed of a wiring board 5 having a conductor layer 3 and the surface insulating layer 1 covering the surface of the board 5, and composed of a photosetting resin. The insulating layer 1 has a light shielding section 12 containing a light shielding material on the wiring board 5 side. In addition, the printed wiring board has a light transmitting section 11 on the opposite side of the wiring board 5. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003318521(A) 申请公布日期 2003.11.07
申请号 JP20020122805 申请日期 2002.04.24
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA
分类号 H05K3/28;(IPC1-7):H05K3/28 主分类号 H05K3/28
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