| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a thin film device enhancing productivity of a transfer process and suitable for a lightweight and thin display panel without damaging toughness by separating an adhesive layer in transfer technology in a short period of time and a large area. SOLUTION: The thin film device adheres a second substrate 106 through a first adhesive layer 105 on a thin film device layer 103 provided on a protection layer 102 formed on a first substrate 101. Then, the first substrate 101 is completely or partially removed by a process of at least one of chemical treatment or mechanical polishing processing. A third substrate 109 is adhered through a second adhesive layer 108 on the exposed protection layer 102 or the protection layer 102 covered with the partially removed first substrate 101. Then, the thin film device is manufactured by weakening adhesive strength of the first adhesive layer 105 by cooling and separating the second substrate 106. COPYRIGHT: (C)2004,JPO
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