发明名称 |
Heat-radiating structure with low height |
摘要 |
A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is formed with multiple first perforations arranged at intervals and multiple first dents arranged at intervals and extending downward. The second heat-radiating plate is formed with multiple second perforations arranged at intervals and multiple second dents extending downward and fitted with the first perforations. A heat-generating body such as a CPU is adjacent to outer sides of the bottoms of the first and second dents. The heat-radiating structure has a height much smaller than that of a conventional vertical heat-radiating plate and a heat conducting area much larger than that of the vertical heat-radiating plate. Accordingly, the heat-radiating structure can achieve better heat-radiating effect and is applicable to those products having small internal space and necessitating heat-radiation, such as a portable computer.
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申请公布号 |
US2003205369(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030425954 |
申请日期 |
2003.04.30 |
申请人 |
LIU MING-HWA;CHEN BRIAN D.F.;CHANG CHENG PAUG |
发明人 |
LIU MING-HWA;CHEN BRIAN D.F.;CHANG CHENG PAUG |
分类号 |
F28F3/02;H01L23/367;H01L23/467;(IPC1-7):H05K7/20;F28F7/00;H01L23/26 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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