Power semiconductor module has element mounted on metal layers formed on a insulating substrate that is mounted on a heat sink base

摘要

The power semiconductor module has an electrically isolating substrate (10) with metal layers (12) on one side that is soldered (13) to a heat sink (14). On the topside are metal coil layers (11) for inductive coupling with the semiconductor power element (16) linked by bond wires (17) to the coils.