发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive composition which develops excellent adhesiveness to a polyolefin resin-based material, a cellulose fiber-based material, etc., has reduced reduction in adhesive strength with time, keeps excellent adhesiveness for a long period of time and does not causes troubles in an applicator in use and has excellent heat stability. SOLUTION: The hot-melt adhesive composition comprises 10-40 parts wt. of a thermoplastic block copolymer of a vinylaromatic hydrocarbon polymer block having a glass transition temperature (Tg) of a room temperature or above and a (hydrogenated) diene polymer block e, 30-70 parts wt. of a C5-based or C9-based petroleum resin, 5-40 parts wt. of a plasticized oil, 0.1-3 parts wt. of a phenol-based antioxidant and 0.1-3 parts wt. of an organic sulfur-based antioxidant as essential components. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003313529(A) 申请公布日期 2003.11.06
申请号 JP20020116741 申请日期 2002.04.18
申请人 SEKISUI CHEM CO LTD 发明人 HONDA JUNICHI
分类号 C09J153/02;C09J157/02;C09J191/00;(IPC1-7):C09J153/02 主分类号 C09J153/02
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