| 摘要 |
An integrated circuit package with a path of high thermal conductivity is disclosed. The package is formed into a substrate, through which an opening has been formed to receive a thermally conductive slug, formed of a material such as copper. An integrated circuit chip is mounted to one side of the slug, and the opposing surface of the slug is exposed at the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to the underside of the substrate and of the slug in ball-grid-array fashion, for mounting to a circuit board. Upon mounting to the cicuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls. According to one of the alternative disclosed embodiments, the slug extends below the surface of the substrate, and has a solder mask with larger apertures than the electrical conductors of the substrate; equivalently sized solder balls may thus be used to connect to the circuit board, to provide larger thermal conductive leads to the slug. <MATH> |
