| 发明名称 |
Electroplating bath control |
| 摘要 |
Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
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| 申请公布号 |
US2003205476(A1) |
申请公布日期 |
2003.11.06 |
| 申请号 |
US20030457277 |
申请日期 |
2003.06.09 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
CALVERT JEFFREY M.;BINSTEAD ROBERT A. |
| 分类号 |
C25D21/12;C25D21/14;(IPC1-7):C25D21/12 |
主分类号 |
C25D21/12 |
| 代理机构 |
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