发明名称 Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof
摘要 A multi-layer film for a thin film structure, a capacitor using the multi-layer film and methods for fabricating the multi-layer film and the capacitor, the multi-layer film including a composition transition layer between a lower material layer and an upper material layer respectively formed of different elements whose interaction parameters are different from each other, the composition transition layer containing both elements of the lower and upper material layers, the concentration of the composition transition layer gradually varying from the portion of the composition transition layer contacting with the lower material layer to the portion of the composition transition layer contacting with the upper material layer such that the concentration of the element of the upper material layer is relatively large in its portion adjacent to the upper material layer, each of the lower and upper material layers being formed of an oxide or nitride material of aluminum, silicon, zirconium, cerium, titanium, yttrium, tantalum or niobium.
申请公布号 US2003207529(A1) 申请公布日期 2003.11.06
申请号 US20030410341 申请日期 2003.04.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM JAE-SOON;KIM YEONG-KWAN;PARK HEUNG-SOO;LEE SANG-IN
分类号 H01L27/04;H01G9/04;H01L21/02;H01L21/31;H01L21/314;H01L21/316;H01L21/318;H01L21/469;H01L21/822;H01L21/8242;H01L27/108;H01L31/119;(IPC1-7):H01L21/824 主分类号 H01L27/04
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