发明名称 MANUFACTURING METHOD OF PRESSURE SENSOR, AND MEASURING DEVICE FOR USE IN THE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sensitivity measuring device for a pressure sensor that can measure sensitivity on a wafer basis. SOLUTION: The measuring device comprises a stage 20 mountable with a wafer 10 in which pressure detection parts for outputting an electrical signal corresponding to pressure are formed in chip units, a stage pressure control part 21, 40 and 51 for applying a controllable pressure to the wafer 10 from the side of the stage 20, a chamber pressure control part 52 and 110 capable of controlling the pressure in a pressure chamber 30, a stage drive part 60 and 70 capable of moving the stage 20 to a desirable position in the pressure chamber 30, and a probe 80 capable of detecting an electrical signal corresponding to the pressure in the pressure chamber 30 output from an individual pressure detection part in the wafer 10. The wafer 10 mounted on the stage 20 is fixed on the stage 20 by a pressure difference between the pressure from the side of the stage 20 and the pressure in the pressure chamber 30. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003315196(A) 申请公布日期 2003.11.06
申请号 JP20020124317 申请日期 2002.04.25
申请人 DENSO CORP 发明人 HARA HIDEAKI;CHIKUAN KENJI
分类号 G01L27/00;G01L9/00;H01L21/66;H01L29/84;(IPC1-7):G01L27/00 主分类号 G01L27/00
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