| 摘要 |
PROBLEM TO BE SOLVED: To provide a printing-wiring board attached to an organic fiber base material, which maintains dimensional stability and punchability and, simultaneously, improves heat resistance. SOLUTION: An epoxy resin comprising a trifunctional epoxy resin and a cresol novolak type epoxy resin at a compounding mass ratio of 90/10 to 50/50 and, simultaneously, 10-20 mass% bifunctional epoxy resin is prepared. Then, a nonwoven fabric of an aramid fiber is impregnated with this epoxy resin composition, and dried to form a prepreg. The nonwoven fabric has a p-aramid fiber (a poly-p-phenylene terephthalamide fiber pulp or the same pulp and a poly-p-phenylene terephthalamide fiber chop) as the major components and is obtained by integrating the fibers with each other by using a thermosetting binder and a second binder selected from a fiber chop of a thermosetting resin having a softening point of≥220°C, a pulp of the same fiber, and a fibrid of the same fiber. The trifunctional epoxy resin preferably has an epoxy equivalent weight of≥185 g/eq. COPYRIGHT: (C)2004,JPO |
