| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus for improving the throughput, and a liquid treatment method. SOLUTION: An electrolysis plating apparatus 1 comprises a plating liquid tank 4 for storing a plating liquid, and a holder 20 for holding a wafer W. The holder 20 has a holder vessel 21 in which a sealing member 31 is arranged so as to prevent a cathode electrode 35 contacting with the wafer W from contacting with the plating liquid. The sealing member 31 has an inclined part 31b formed therein so as to descend toward an inside edge 31b<SB>2</SB>from an outside edge 31b<SB>1</SB>. COPYRIGHT: (C)2004,JPO
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