| 摘要 |
PROBLEM TO BE SOLVED: To provide a removable heat-resistant acrylic adhesive tape which is used for fixing semiconductor devices in a process for manufacturing the semiconductor devices and for protecting electrodes in a process for molding a resin, has an adhesive characteristic enough for holding chips on the electrodes in a wire bonding process and for preventing the contamination of a resin on the surfaces of the electrodes in a molding process, does not produce an outer gas, when heated, and can easily be peeled, after used. SOLUTION: This removable heat-resistant adhesive tape for fixing the semiconductor devices is characterized by laminating a radiation-curable acrylic adhesive to the roughed surface of a heat-resistant film having a heat shrinkage constant of≤0.2%, when heated at 200°C. COPYRIGHT: (C)2004,JPO
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