发明名称 Semiconductor LED flip-chip with dielectric coating on the mesa
摘要 A dielectric layer is formed on the mesa wall of a flip-chip LED. The dielectric layer is selected to maximize reflection of light incident at angles ranging from 10 degrees towards the substrate to 30 degrees away from the substrate. In some embodiments, the LED is a III-nitride device with a p-contact containing silver, the dielectric layer adjacent to the mesa wall is a material with a low refractive index compared to GaN, such as Al2O3.
申请公布号 US2003205712(A1) 申请公布日期 2003.11.06
申请号 US20030461173 申请日期 2003.06.12
申请人 BHAT JEROME C.;LUDOWISE MICHAEL J.;STEIGERWALD DANIEL A. 发明人 BHAT JEROME C.;LUDOWISE MICHAEL J.;STEIGERWALD DANIEL A.
分类号 H01L21/314;H01L21/316;H01L33/20;H01L33/32;H01L33/40;H01L33/46;(IPC1-7):H01L27/15;H01L31/12;H01L33/00 主分类号 H01L21/314
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