发明名称 |
Conformal thermal interface material for electronic components |
摘要 |
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
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申请公布号 |
US2003207064(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
US20030414884 |
申请日期 |
2003.04.16 |
申请人 |
BUNYAN MICHAEL H.;SORGO MIKSA DE |
发明人 |
BUNYAN MICHAEL H.;SORGO MIKSA DE |
分类号 |
H01L23/36;C09K5/00;C09K5/06;H01L23/373;(IPC1-7):C09J1/00 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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