| 摘要 |
The inventive method for the wedge-free bonding of planar surfaces comprises, in essence, a concluding phase involving bringing the surfaces to be bonded closer together. During this phase, the surfaces are brought closer together essentially by means of capillary forces and, optionally, with the aid of gravity. It is advantageous, before the actual bonding process, to parallelly align the surfaces to be bonded by simply placing one component atop the other. This enables, once adhesive (11) has been applied to the center of the first surface, the second surface, in the initial phase, to be quickly advanced toward the first surface up to a distance of 0.5 mm therefrom. In the intermediate phase of bringing the surfaces closer together, a slow average speed is selected in order to prevent the formation of bubbles once the adhesive comes into contact with the second surface. |
